DSA 2023 The 10th IEEE International Conference on Dependable Systems and Their Applications http://dsa.techconf.org August 10-11, 2023 Waseda University, Tokyo, Japan ------------------------------------------------------------- Important Dates ------------------------------------------------------------- May 05, 2023:     Regular & Short papers May 15, 2023:     Workshop Papers June 01, 2023:     Fast Abstract June 01, 2023:     Industry Track July 01, 2023:     Author Notification ------------------------------------------------------------------------------- Best Paper Award ------------------------------------------------------------------------------- At least one Best Paper Award will be presented. ------------------------------------------------------------------------------- Topics of Interest ------------------------------------------------------------------------------- * Algorithms, Architecture, Framework, Design Patterns, and    Maintenance for Dependable Systems and Software * Security, Threats, Privacy, Safety, and Risk Management * Dependability and Reliability Modelling and Measurement * Fault Tolerance, Survivability, Resilience, and Availability * Metrics, Measurement, and Quality Assessment * Requirements, Process, Standards, Productivity, and Project Management * Quality Assurance, Maintenance, Reverse Engineering, and Re-Engineering * Verification, Validation, Testing, Analysis, Debugging,    Model Checking, and Program Repair * Formal Methods and Theories * Communication, Networking, Optimization, and Performance * Pervasive, Ubiquitous, Service-Oriented, and Cloud Computing * Collaborative, Distributed, Embedded, Real-Time, High Performance,    Highly Dependable, Intelligent, Multimedia Systems * Big Data and Storage * Prognostics and Health Management * IoT, Supply Chain, Cyber-Physical Systems, Industry 4.0, and Smart City * Empirical Studies, Benchmarking, and Industrial Best Practices * Applications and Tools and Automation * Approaching Artificial Creativity ------------------------------------------------------------------------------- Conference Proceedings ------------------------------------------------------------------------------- The proceedings will be published by IEEE Conference Publishing Services. Accepted papers will also be submitted for inclusion into the IEEE Xplore and to other abstracting and indexing partners such as the Ei Compendex. Submission page: https://dsa23.techconf.org/submission ------------------------------------------------------------------------------- SCI Journal Publication ------------------------------------------------------------------------------- Papers of top quality will be invited to submit their extended versions to a special issue of a selected SCI journal. ------------------------------------------------------------------------------- Organizing Committee ------------------------------------------------------------------------------- General Chairs: Professor Hironori Washizaki, Waseda University, Japan Professor Gordon Fraser, University of Passau, Germany Program Chairs Professor Rui Maranhão, University of Porto, Portugal Professor Ying Qian, Chongqing University of Posts and Telecommunications, China https://dsa23.techconf.org/committee/organizing ------------------------------------------------------------------------------- General Inquiries ------------------------------------------------------------------------------- For more details and updated information, please refer to http://dsa.techconf.org, or send emails to [email protected]