March 2021 - hpc-announce - mailman3.cels.anl.gov

ICPP 2021 workshops
by Osni Marques 31 Mar '21

31 Mar '21

----- General Call for Papers for ICPP 2021 Workshops ------- ICPP (International conference on Parallel Processing) is a forum that gives engineers and scientists in academia, industry and government an opportunity to present forefront research in all aspects of parallel and distributed computing. The 50th ICPP will be held in Chicago, IL, August 9-12, 2021. More information about ICPP 2021 can be found at http://icpp-conf.org. We invite researchers and practitioners to submit their work to the following workshops that will be held jointly with ICPP 2021: AWASN - International Workshop on Applications of Wireless Ad hoc and Sensor Networks https://www.comp.sd.tmu.ac.jp/kazuyasakai/events/awasn21.html DUAC - International Workshop on Deployment and Use of Accelerators https://duac2021.wordpress.com EMS - International Workshop on Embedded Multicore Systems https://sites.google.com/view/icpp-ems-2021 EXA_PMRA - International workshop on Performance modelling, Runtime System and Applications at the Exascale https://hpc-apps.github.io/EXA_PMRA21 LLPP - Workshop on LLVM in Parallel Processing https://llvm.org/devmtg/2021-06-28 PDADS - International Workshop on Parallel and Distributed Algorithms for Decision Sciences https://www.csm.ornl.gov/workshops/PDADS P2S2 - International Workshop on Parallel Programming Models and Systems Software for High-End Computing https://pmodels.github.io/p2s2-www/2021 SRMPDS - International Workshop on Scheduling and Resource Management for Parallel and Distributed Systems https://srmpds.github.io For further information, please visit http://icpp-conf.org or the websites of the workshops listed above. Federico Silla Osni Marques ICPP 2021 Workshop Chairs

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[TSP 2021 | virtual | July 26-28] EXTENDED DEADLINE: April 20 | 44th Int. Conference on Telecommunications and Signal Processing (IEEE Xplore, Scopus, WoS)
by IEEE R8 Tech. Co-Sponsored TSP 2021 31 Mar '21

31 Mar '21

[ We apologize if you receive multiple copies of this email. Please distribute this CfP to your colleagues. ] ************************************************************************************ *2021 44th International Conference on Telecommunications and Signal Processing (TSP - IEEE Conference Record #52935) *July 26-28, 2021 (virtual conference) Web: http://tsp.vutbr.cz/ • *Deadline for Special Session and Workshop Proposals*: April 20, 2021 (extended deadline) • *Deadline for Full Paper Submissions*: April 20, 2021 (extended deadline) #StaySafeAtHome ************************************************************************************ */Technical co-sponsors:/*/IEEE Region 8 (Europe, Middle East and Africa), IEEE Czechoslovakia Section, IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, and Scientific Association for Infocommunications, a Sister Society of the IEEE and the IEEE Communications Society. The TSP 2021 Proceedings, containing presented papers at the Conference, will be submitted for indexing to the IEEE Xplore® Digital Library - IEEE Conference Record #52935, SCOPUS, Conference Proceedings Citation Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases./ *After the conference, the authors of about 40% of the highest rated papers will also be invited to submit the extended version for publishing in Special Journal Issues (papers to be published after significant extension and new review process): * /• *Applied Sciences* - Special Issue 'Selected Papers from the 2020 43rd and 2021 44th International Conference on Telecommunications and Signal Processing (TSP)' of Applied Sciences (ISSN 2076-3417), an international peer-reviewed open access journal on all aspects of applied natural sciences published by MDPI and indexed by Web of Science (CiteScore 2019 Scopus data: 2.4, which equals rank 85/299 (Q2) in 'General Engineering' and 233/460 in 'General Materials Science'; current Impact Factor: 2.474) • *Remote Sensing* - Special Issue 'Advances in Signal Processing Techniques for Ground Penetrating Radar Applications' of Remote Sensing (ISSN 2072-4292), an international peer-reviewed open access journal about the science and application of remote sensing technology published by MDPI and indexed by Web of Science (JCR category rank: 9/30 (Q2) in 'Remote Sensing';current Impact Factor: 4.509) • *Sensors* - Special Issue 'Signal Processing Circuits and Systems for Smart Sensing Applications' of Sensors (ISSN 1424-8220), an international peer-reviewed open access journal on the science and technology of sensors published by MDPI and indexed by Web of Science (CiteScore (2019 Scopus data: 5.0; ranked 17/129 (Q1) in 'Physics and Astronomy: Instrumentation' and 147/670 (Q1) in 'Electrical and Electronic Engineering' and 70/300 (Q1) in 'Computer Science: Information Systems';current Impact Factor: 3.275) • *International Journal of Advances in Telecommunications, Electrotechnics, Signals and Systems (IJATES)* (ISSN 1805-5443), indexed by Google Scholar, CrossRef, WorldCat, EZB Elektronischen Zeitschriftenbibliothek, and Directory of Open Access Journals/ ************************************************************************************ Dear Colleague and Friend, You are kindly invited to participate in the */2021 44th International Conference on Telecommunications and Signal Processing (TSP - http://tsp.vutbr.cz/ - IEEE Conference Record #52935)/*, which will be organized online during */July 26-28, 2021/*. The TSP Conference serves as a premier annual international forum to promote the exchange of the latest advances in telecommunication technology and signal processing. The aim of the conference is to bring together both novice and experienced scientists, developers, and specialists, to meet new colleagues, collect new ideas, and establish new cooperation between research groups from universities, research centers, and private sectors from the whole Europe, America, Asia, Australia, and Africa. */TOPICS: /* TSP 2021, driven by the theme '*/The age of A.I./*', has opened Calls for Workshop and Special Session Proposals and Full Paper Submissions with deadline set April 20, 2021 (extended deadline). We look forward to your innovative contributions in any of the following areas: /AREA 1: Telecommunications / 1. Information Systems 2. Network Services 3. Network Technologies 4. Telecommunication Systems 5. Modelling, Simulation and Measurement /AREA 2: Signal Processing / 6. Analog Signal Processing 7. Audio, Speech and Language Processing 8. Biomedical Signal Processing 9. Digital Signal Processing 10. Image and Video Signal Processing For more details, please visit the Conference website at http://tsp.vutbr.cz/?page_id=121 . */WORKSHOPS AND SPECIAL SESSIONS: /* Prospective Organizers are invited to submit proposals for Workshops and Special Sessions held during the TSP 2021 Conference. The following Workshop was approved so far: • *WS1*: 5th International Workshop on Recent Advances in Biometrics and its Applications organized by Assoc. Prof. Dr. Larbi Boubchir and Prof. Boubaker Daachi (both from the LIASD – University of Paris 8, France) Organizing guidelines are available at http://tsp.vutbr.cz/?page_id=3492 . */STUDENT BEST PAPER AWARD: /* In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, to recognize outstanding technical contributions by students, as evidenced by the quality of the papers, their presentations, and their technical excellence, the authors of the Best 5 Student Papers will be awarded during the conference by the Technical Committee. The Best Student Paper Award consists of a Certificate of Appreciation. */ORGANIZERS: /* The TSP 2021 is an IEEE technically co-sponsored conference organized in cooperation with eighteen universities: • Brno University of Technology, Department of Telecommunications, Brno, Czech Republic • Budapest University of Technology and Economics, Department of Telecommunications and Media Informatics, Budapest, Hungary • Czech Technical University in Prague, Department of Telecommunication Engineering, Prague, Czech Republic • Isik University, Department of Electrical and Electronics Engineering, Sile/Istanbul, Turkey • Istanbul Technical University, Electronics and Communication Engineering Department, Istanbul, Turkey • Josip Juraj Strossmayer University of Osijek, Faculty of Electrical Engineering, Computer Science and Information Technology Osijek, Osijek, Croatia • Karadeniz Technical University, Department of Electrical and Electronics Engineering, Trabzon, Turkey • National Taiwan University of Science and Technology, Department of Electronic and Computer Engineering, Taipei, Taiwan • Seikei University, Graduate School and Faculty of Science and Technology, Information Networking Laboratory, Tokyo, Japan • Slovak University of Technology in Bratislava, Institute of Multimedia Information and Communication Technologies, Bratislava, Slovak Republic • Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain • Technical University of Sofia, Faculty of Telecommunications, Sofia, Bulgaria • Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée de Saint-Denis (LIASD), France • University “Politehnica” of Bucharest, Center for Advanced Research on New Materials, Products and Innovative Processes (“CAMPUS”) • University of Ljubljana, Laboratory for Telecommunications, Ljubljana, Slovenia • University of Patras, Physics Department, Patras, Greece • VSB - Technical University of Ostrava, Department of Telecommunications, Ostrava, Czech Republic • West Pomeranian University of Technology, Faculty of Electrical Engineering, Szczecin, Poland */COMMITTEES: /* • Honorary Chair - Miloslav Filka, Brno University of Technology, Czech Republic – Full Professor, TSP Conference Founder • General Chair - Norbert Herencsár, Brno University of Technology, Czech Republic – IEEE Czechoslovakia Section CAS/COM/SP Joint Chapter Chair, IEEE Senior Member • Publications & Student Paper Contest Chair - Jiří Hošek, Brno University of Technology, Czech Republic – IEEE Member • Finance Chair - Nándor Mátrai, Asszisztencia Congress Bureau, Hungary – Managing Director • Registration Chair - Csilla Fülöp, Asszisztencia Congress Bureau, Hungary – Project Manager /Steering Committee: / • Francesco Benedetto, University of “Roma TRE”, Italy – Full Professor, IEEE Senior Member • Larbi Boubchir, Université Paris 8, France – Associate Professor, IEEE Senior Member • Marcos Faundez-Zanuy, Escola Universitaria Politecnica de Mataró, Tecnocampus, Spain – Full Professor, Dean • Izzet Cem Göknar, Işik University, Turkey – Institute of Science Director & Circuits and Systems (CAS) Society Turkey Chapter Chair, Full Professor, IEEE Life Fellow • Ray-Guang Cheng, National Taiwan University of Science and Technology (NTUST), Taiwan – Full Professor, IEEE Senior Member • Ismail Kaya, Karadeniz Technical University, Turkey – Full Professor • Jaroslav Koton, Brno University of Technology, Czech Republic – Vice-dean for Research, IEEE Senior Member • Sridhar Krishnan, Ryerson University, Canada – Full Professor & Associate Dean, IEEE Senior Member • Mario Kušek, University of Zagreb, Croatia – IEEE Croatia Section Communications Chapter Chair, IEEE Member • Antonio Luque, University of Seville, Spain – IEEE Region 8 Vice Chair Member Activities 2017, IEEE Spain Section Chair 2016-2017, IEEE Senior Member • Shahram Minaei, Dogus University, Turkey – Full Professor, IEEE Senior Member • Jiří Mišurec, Brno University of Technology, Czech Republic – Full Professor, Department Chair • Ram M. Narayanan, The Pennsylvania State University, USA – Full Professor, IEEE Fellow • Kimio Oguchi, Seikei University, Japan – Full Professor, IEEE Senior Member • Serdar Özoguz, Istanbul Technical University, Turkey – Full Professor, Associate Chair • Jakub Pęksiński, West Pomeranian University of Technology, Poland • Hector Perez-Meana, National Polytechnic Institute, Mexico – Full Professor, IEEE Senior Member • Vladimir Poulkov, Technical University of Sofia, Bulgaria – Full Professor, Dean, IEEE Senior Member • Costas Psychalinos, University of Patras, Greece – Full Professor, IEEE Senior Member • Markus Rupp, Vienna University of Technology, Austria – Full Professor, Dean, IEEE Fellow • Zdeněk Smékal, Brno University of Technology, Czech Republic – Full Professor, IEEE Senior Member • Attila Vidács, Budapest University of Technology and Economics, Hungary – Deputy Head of Department • Miroslav Vozňák, VŠB-Technical University of Ostrava, Czech Republic – Full Professor, Department Chair, IEEE Senior Member • Drago Žagar, Josip Juraj Strossmayer University of Osijek, Croatia – Full Professor, Dean, IEEE Senior Member */IMPORTANT DATES: /* • *Deadline for Special Session and Workshop Proposals*: April 20, 2021 (extended deadline) • *Deadline for Full Paper Submissions*: April 20, 2021 (extended deadline) • *Notification of Paper Acceptance*: June 15, 2021 • *Final Paper Submission*: June 30, 2021 • *Authors' Registration and Payment*: June 15 - July 15, 2021 • *Virtual Conference*: July 26-28, 2021 */CONTACTS: /* For more information, please visit the Conference website at http://tsp.vutbr.cz/. We are also ready to answer your questions emailed to tsp(a)feec.vutbr.cz . Looking forward to meeting you at the conference. With best regards, Norbert Herencsar TSP 2021 General Chair Web: http://tsp.vutbr.cz/ E-mail: tsp(a)feec.vutbr.cz Follow us on: • *Facebook*: https://www.facebook.com/tspconf/ • *Twitter*: https://twitter.com/tspconf/ =================================================== Assoc. Prof. Norbert Herencsar, Ph.D. Department of Telecommunications Faculty of Electrical Engineering and Communication Brno University of Technology Technicka 3082/12 616 00 Brno Czech Republic ************************************************************************************ TSP Organizers reserve the right to exclude a paper from distribution after the Conference (e.g., non-indexing in IEEE Xplore® and other databases) if the paper is not presented at the conference. ************************************************************************************

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Quantum Computing: Principles and Paradigms : Call for Chapters
by Rajkumar Buyya 30 Mar '21

30 Mar '21

=========================================================================== Quantum Computing: Principles and Paradigms Publisher (Tentative): Wiley or Elsevier Edited by: Muhammad Usman and Rajkumar Buyya Book Website: http://clouds.cis.unimelb.edu.au/qcbook/ OR http://cloudbus.org/qcbook =========================================================================== Call for Book Chapters: =========================================================================== Quantum Computing is an emerging paradigm of research and development, with enormous potential to offer disruptive computational capabilities which can revolutionise many areas including data science, drug discovery, particle physics, materials design and optimisation tasks. This book aims to cover a broad range of topics, providing an up-to-date and comprehensive reference of the rapid progress in the field of quantum computing and related technologies from major international companies (such as IBM, Google, Intel, Rigetti, Q-Control) and academic researchers. The book will serve as a key source for a diverse range of audience including graduate students, industry developers and university academics. Some of the key topics to be covered in this book are as follows: Topics: (Tentative and more to be added) 1) Quantum Hardware Development - Spin qubits in silicon, Superconducting qubits, Trapped ions qubits, Photonic qubits - Integrated Spin-photon systems - Scalability and relevant issues - Quantum Control 2) Quantum Error Correction - Error Correction Codes - Topological Codes (Surface Code, Colour Code, Heavy-hexagonal code) - Variational Quantum Error Correction - Quantum Noise Characterisation and Mitigation Strategies 3) Quantum Simulations, Algorithms and Quantum Supremacy - Quantum-Classical Hybrid Machine Learning - Quantum Variational Algorithms - Quantum Approximate Optimisation Algorithm (QAOA) - Quadratic Unconstrained Binary Optimisation (QUBO) - Adiabatic Quantum Computing - Quantum Supremacy - IQP Problem - Variational Eigensolver (VQE) 4) Quantum Software Development - Quantum OS (operating systems) - Quantum Runtime Systems - Quantum Application Programming Models - Quantum Resource Management Systems - Quantum Application Schedulers.. - Quantum and Cloud Computing Integration Systems - Quantum Algorithms - Quantum Data Structures 4) Quantum Communications - Post-quantum cryptography - Quantum Key Distribution - Quantum Internet - Quantum Satellite Communications 5) Quantum Applications and Emerging Topics - Quantum Chemistry Simulations - Quantum Finance - Quantum Traffic Routing - Quantum Machine Learning - Quantum Data Science - Quantum Portfolio Optimisation - Quantum Particle Physics - Quantum Cloud Computing - Quantum Compiler Important Dates - Proposed Chapter Proposal: You are invited to submit a 1-2 pages proposal to describing the topic of your chapter. The proposal should include the chapter organization, anticipated number of pages of the final manuscript and brief biography of authors. We plan to follow the timeline given below: * Proposal deadline: July 30, 2021 (Early expression of interest is highly encouraged) * Notification of proposal acceptance: August 30, 2021 * Full draft chapter submission: November 30, 2021 * Chapter review report to authors: Jan 30, 2022 * Final version submission: March 30, 2022 Early submission is highly appreciated as the editors would like to have progressive dialogue and work with prospective authors to bring out a book of wide appeal. Please email your proposal to both editors in a single email message with subject “QC Book Chapter Proposal” and attach your proposal in PDF / Word format. If we receive more than one proposal for a chapter on the same topic, the editors may request authors to collaborate to develop an integrated chapter. Manuscript Submission Each accepted chapter should have about 20-35 A4 pages. We expect to deliver CRC of the book to the publisher. A MS Word template will be provided later. Editors: * Dr. Muhammad Usman Senior Lecturer School of Computing and Information Systems The University of Melbourne, Australia Email: muhammad.usman(a)unimelb.edu.au * Professor Rajkumar Buyya Director, Cloud Computing and Distributed Systems (CLOUDS) Lab School of Computing and Information Systems The University of Melbourne, Australia Email: rbuyya(a)unimelb.edu.au ===========================================================================

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24th Euromicro Conference on Digital System Design - Deadline extension
by João Canas Ferreira 30 Mar '21

30 Mar '21

24th Euromicro Conference on Digital System Design Palermo, Sicily, Italy, Sept. 1st – Sept. 3rd , 2021 https://dsd-seaa2021.unipv.it/ *Important dates* Deadline for paper submission: April 20th (extension) Notification of acceptance: May 20th Camera ready papers: June 15th *General Chair* Salvatore Gaglio (U Palermo, IT) *Program Chairs* Salvatore Vitabile (U Palermo, IT) Francesco Leporati (U Pavia, IT) *Scope* The Euromicro Conference on Digital System Design (DSD) addresses all aspects of (embedded, pervasive and high-performance) digital and mixed HW/SW system engineering, covering the whole design trajectory from specification down to micro-architectures, digital circuits and VLSI implementations. It is a forum for researchers and engineers from academia and industry working on advanced investigations, developments and applications. *Main Topics* * Design and synthesis of systems, hardware and embedded software * IoT, cyber-physical and embedded systems * Systems-on-a-chip, networks-on-a-chip and systems-in-a-package * Programmable/re-configurable/adaptable architectures * Reliable, Secure, Safe and Optimized systems and their design methods * Formal Methods in System Design * Specification, modeling, analysis, validation and test for systems, hardware and embedded software * Design automation at system, register-transfer, logic and physical levels * Advanced applications of embedded and cyber-physical systems * Application analysis and parallelization for embedded and high-performance design * New issues introduced by emerging applications and technologies *Special Sessions* * Architectures and Hardware for Security Applications * Applications, Architectures, Methods and Tools for Machine- and Deep Learning * Architectures and Systems for Automotive, Aeronautic, Space and Intelligent Transportation * Advanced Systems in Healthcare, Wellness and Personal Assistance * Hardware and Systems for Smart Farming, Food Chain and Sustainable Environments * Design of Cyber-Physical Systems * Dependability, Testing and Fault Tolerance in Digital Systems * European Projects in Digital System Design * Future Trends in Emerging Technologies * Mixed-Criticality System Design, Implementation and Analysis * Security and Privacy of Cyber-Physical Systems Authors are encouraged to submit their manuscripts via Easychair web service at web page https://easychair.org/conferences/?conf=dsd2021. IEEE Conference Publishing Services (CPS) will publish accepted papers in the conference proceedings and the proceedings will be submitted to the IEEE Xplore Digital library and indexing services. Extended versions of selected best papers will be published in a special issue of the ISI indexed Euromicro/Elsevier journal “Microprocessors and Microsystems: Embedded Hardware Design” (MICPRO). *DSD Steering Committee* Lech Jóźwiak (TU Eindhoven, NL) - Chairman Paris Kitsos (U of Peloponnese, GR) Hana Kubatova (CTU Prague, CZ) Francesco Leporati (U Pavia, IT) José Silva Matos (U Porto, PT) António Nuñez (IUMA/ULPGC, ES) Eugenio Villar (TEISA U Cantabria, ES)

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Call for WIP and DEMO Papers :: SMARTCOMP 2021, Aug 23-27, 2021, Irvine, CA, USA
by Mattia Campana 30 Mar '21

30 Mar '21

[Apologies if you receive multiple copies of this message] ======================================================= CALL FOR WIP-DEMO PAPERS ****************************************************************** The 7th IEEE International Conference on Smart Computing (SMARTCOMP 2021), August 23-27, 2021 in Irvine, Orange County, California, USA https://www.smart-comp.info ********************************************************************************** The 7th IEEE International Conference on Smart Computing (SMARTCOMP 2021) draws upon many application disciplines such as transportation, energy, environmental protection, resource management, healthcare, security, banking, entertainment, and social media. In addition to full-length technical papers, SMARTCOMP welcomes Work in Progress (WIP) papers and technical demonstrations (Demos) showing innovative and original research in the areas of smart computing. Submissions from both industry and academia are strongly encouraged. WIP papers are expected to report on early or ongoing research activities, while Demo papers are expected to present innovative applications and tools. The WIP and Demo sessions will provide a forum to discuss novel ideas and emerging results, presenting innovative applications and tools, and bring about novel research questions, approaches, and directions. Currently the conference is planned to be in Irvine, Orange County, California, USA. However, there is a possibility of moving to either a hybrid or fully online mode depending on the pandemic situation. TOPICS Areas of interest include (but are not limited to): * Smart Computing Technologies and Applications * Smart Cyber-Physical Systems and Energy/ Water/ Agriculture/ Transportation/ Healthcare/ Banking Infrastructure * Future Smart Computing Paradigms * Smart Human Environments, Health, Entertainment, and Social Activities * Smart Computing for Environmental change (e.g., Energy Management and Analytics, Smart Transportation) * Big Data, Artificial Intelligence and Machine Learning for Smart Computing * Middleware Platforms for Smart Environments * Mobile and Ubiquitous Platforms for Smart Environments * Cloud, Edge and Fog Computing Platforms for Smart Systems * Security, Privacy, and Economics in Smart Environments WIP and Demo papers should be no more than 3 pages in length, including figures, tables, and references and formatted according to the two-column IEEE proceedings template. IEEE provides corresponding formatting templates at *IEEE conference template*. Make sure to use the conference mode of the template, i.e., LaTeX users must use the conference option of the IEEEtran document class. WIP papers are expected to present early or ongoing research activities. Novel approaches and preliminary results are especially appreciated. Demo papers should explicitly state what will be demonstrated to the audience, and how the attendees will be able to interact, enjoy, and experiment. Papers must be submitted electronically as a single PDF file on US Letter size paper (not A4), with all fonts embedded (the PDF-A standard complies with that), through EDAS – WiP and Demo Track. Submitted WIP and Demo papers will be subject to peer reviews by SMARTCOMP Technical Program Committee members and other experts in the field. All accepted papers will be published in the conference proceedings, and submitted to the IEEE Xplore Digital Library. They will be presented as posters. At least one author of each accepted paper must register and attend the conference to present the work. Authors are requested to submit original, unpublished manuscripts in standard IEEE proceedings format in PDF. Paper submissions should be formatted according to the IEEE conference template. Due to the short interval between the notification of acceptance and the camera-ready deadline, we strongly encourage authors to follow the camera-ready formatting guidelines as close as possible even for the initial abstract submission. Submissions must be made via EDAS. When submitting, please select the “SMARTCOMP 2021: WIP and Demo” track. IMPORTANT DATES: Paper Submission: 31 May 2021 Acceptance Notification: 20 June 2021 Camera ready: 30 June 2021 WIP AND DEMO CO_CHAIRS: Franca Delmastro, IIT-CNR, Italy (franca.delmastro(a)iit.cnr.it) Simone Silvestri, University of Kentucky, USA (silvestri(a)cs.uky.edu) ******************************************************************************************************

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CfP ONLINE / Deadline Extension: eScience 2021: 17th IEEE International eScience Conference
by Philipp Gschwandtner 29 Mar '21

29 Mar '21

================================================================= *COVID-19 UPDATE and DEADLINE EXTENSION* eScience 2021 will be held as an *online* conference. Proceedings will be published as usual. The *submission deadline* for papers, abstracts and tutorials has been *extended* (see below). ================================================================= ======================================================================== Call For Papers 17th IEEE International eScience Conference (eScience 2021) September 20-23, 2021 Innsbruck, Austria http://escience2021.org ======================================================================== Conference Information --------------- Workshop Submissions Due: Monday March 15, 2021 Workshop Acceptance Notification: Tuesday March 30, 2021 Paper/Abstract & Tutorial Submissions Due: Thursday April 15, 2021 Notification of Paper/Abstract and Tutorial Acceptance: Thursday, June 10, 2021 Poster Submissions Due: Tuesday June 15, 2021 Notification of Poster Acceptance: Tuesday June 22, 2021 All Camera-ready Submissions Due: Sunday July 25, 2021 Conference Dates: September 20-23, 2021 Conference & Submission Link --------------- https://escience2021.org/ https://easychair.org/conferences/?conf=escience2021 Call for Papers --------------- The 17th IEEE eScience Conference will be held in Innsbruck, Austria on September 20 – 23, 2021. eScience 2021 brings together leading interdisciplinary research communities, developers, and users of eScience applications and enabling IT technologies. The objective of the eScience Conference is to promote and encourage all aspects of eScience and its associated technologies, applications, algorithms, and tools with a strong focus on practical solutions and open challenges. eScience 2021 interprets eScience broadly as enabling and driving innovation in data- and compute-intensive research across all domains ranging from traditional areas in the physical and earth sciences to emerging disciplines such as the social sciences, arts and humanities, and artificial intelligence for a wide variety of target architectures including HPC, cloud, and IoT infrastructures. Science in all domains is becoming increasingly digital – from capturing and analyzing data in large scale experiments and simulations to the exploitation of machine learning and artificial intelligence techniques. However, many researchers face significant challenges in developing and using e-Infrastructures and associated software and workflows for their problems. Interdisciplinary approaches, combining numerical methods, computer science, and domain science, are needed to tackle these challenges. eScience 2021 provides a forum for researchers and engineers across scientific domains to meet and discuss their challenges and latest developments. Domains include, but are not limited to, life sciences, health research, digital humanities, and social sciences, engineering, physics, chemistry, astronomy, climate science, environmental science, and earth science. The conference targets, but is not limited to, the innovative application of digital technologies to research problems, the development of application software, tools, and libraries that enhance the efficiency and capabilities in the scientific process; and the development of e-Infrastructures providing the required hardware capacities and capabilities. This year, the conference is soliciting three types of contributions: - Abstracts (about 300 words) outlining early ideas on a possible research topic or more mature interdisciplinary developments - Full papers (8 - 10 pages, IEEE format) presenting previously unpublished research achievements or eScience experiences and solutions - Posters (2 pages, IEEE format) to showcase early stage results and innovations All submissions will be peer reviewed; selected abstracts and full papers will receive a slot for an oral presentation. Posters will be presented during a poster reception. Full papers and poster papers will be published in the conference proceedings through the IEEE Digital Library. To be eligible for an oral presentation, authors must submit their full paper or abstract before Thursday April 15, 2021. Rejected full papers can be re-submitted for a poster presentation. All full papers are single-blind peer reviewed and, if accepted, published in the conference proceedings that will be made available online through the IEEE Digital Library. It is a requirement that at least one author of each accepted paper, abstract or poster attends the conference. While we continue to monitor updates on the Covid-19 pandemic, eScience is still planned as an in-person conference to be held in Innsbruck, Austria. The safety and well-being of our attendees and volunteers is of the upmost importance to us which means that if we will be unable to go forward with our in-person conference, we will switch to either a hybrid (in-person and virtual) or fully virtual format. Information about the final conference format will be announced in due time. Independently from the format, accepted papers and posters will be published in the conference proceedings and will be made available through the IEEE digital library. Workshops and tutorials will be held on Monday, September 20 and Thursday, September 23, 2021. Please refer to the call for workshops and call for tutorials for further information. Paper Submission Guidelines --------------- Authors are invited to submit conference papers (8–10 pages) for an oral presentation using the IEEE 8.5x11 manuscript guidelines: double-column text using single-spaced 10-point font on 8.5x11-inch pages. Templates are available from http://www.ieee.org/conferences_events/conferences/publishing/templates.html. Authors are invited to submit a 2-page paper for a poster presentation using the same template as for papers including figures and references. Contributions should be submitted in PDF format to EasyChair: https://easychair.org/conferences/?conf=escience2021 Abstract Submission Guidelines --------------- Authors are invited to submit abstracts (about 300 words) via the online form on https://easychair.org/conferences/?conf=escience2021. Organization --------------- General Chair - Thomas Fahringer (University of Innsbruck, Austria) Program Chairs - Sinéad Ryan (Trinity College Dublin, Ireland) - Erwin Laure (Max Planck Computing and Data Facility, Germany) Publicity and Web Chairs - Philipp Gschwandtner, University of Innsbruck, Austria - Rafael Ferreira da Silva, University of Southern California, Los Angeles, CA, USA Workshop Chairs - Michela Taufer, University of Tennessee, Knoxville, USA - Flavio Vella, Free University of Bozen-Bolzano, Italy Tutorial Chairs - Peter Thoman, University of Innsbruck, Austria - Kento Sato, RIKEN R-CCS, Kobe, Japan Poster Chair - Carsten Trinitis, Technical University Munich, Germany Local Chairs - Philipp Gschwandtner, University of Innsbruck, Austria - Peter Thoman, University of Innsbruck, Austria Industry Chair - Sai Narasimhamurthy, Seagate Technology LLC, UK Finance Chairs - Manuela Resch, University of Innsbruck, Austria - Silvia Haid, University of Innsbruck, Austria eScience Steering Committee - See eScience Steering Committee page https://escience2021.org/steering-committee -- Philipp Gschwandtner, PhD Senior Scientist University of Innsbruck Research Center High Performance Computing https://www.uibk.ac.at/fz-hpc Room 2W05, Technikerstrasse 21a, 6020 Innsbruck, Austria phone +43 512 507-53233 fax +43 512 507-53226

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[CFP: ExaComm 2021 - Deadline Extension] 6th International Workshop on Communication Architectures for HPC, Big Data, Deep Learning, and Clouds at Extreme Scale (ExaComm 2021) in Conjunction with ISC 2021
by Shafi, Aamir 28 Mar '21

28 Mar '21

======================================================================== Call For Papers (Digital Workshop) Sixth International Workshop on Communication Architectures for HPC, Big Data, Deep Learning and Clouds at Extreme Scale (ExaComm 2021) to be held in conjunction with International Supercomputing Conference 2021 Friday July 2, 2021 http://nowlab.cse.ohio-state.edu/exacomm/ ======================================================================== Extreme Scale computing in HPC, Big Data, Deep Learning and Clouds are marked by multiple-levels of hierarchy and heterogeneity ranging from the compute units (many-core CPUs, GPUs, APUs etc) to storage devices (NVMe, NVMe over Fabrics etc) to the network interconnects (InfiniBand, High-Speed Ethernet, Omni-Path etc). Owing to the plethora of heterogeneous communication paths with different cost models expected to be present in extreme scale systems, data movement is seen as the soul of different challenges for exascale computing. On the other hand, advances in networking technologies such as NoCs (like NVLink), RDMA enabled networks and the likes are constantly pushing the envelope of research in the field of novel communication and computing architectures for extreme scale computing. The goal of this workshop is to bring together researchers and software/hardware designers from academia, industry and national laboratories who are involved in creating network-based computing solutions for extreme scale architectures. The objectives of this workshop will be to share the experiences of the members of this community and to learn the opportunities and challenges in the design trends for exascale communication architectures. ExaComm 2021 will be held (digitally) as a full day workshop in conjunction with the International Supercomputing Conference (ISC 2021), on Friday, July 2. Topics ------ ExaComm 2021 welcomes original submissions in a range of areas, including but not limited to: * Scalable communication protocols * High performance networks * Runtime/middleware designs * Impact of high performance networks on Deep Learning / Machine Learning * Impact of high performance networks on Big Data * Novel hardware/software co-design * High performance communication solutions for accelerator based computing * Power-aware techniques and designs * Performance evaluations * Quality of Service (QoS) * Resource virtualization and SR-IOV Papers should present original research and should provide sufficient background material to make them accessible to the broader community. Keynote Speakers ---------------- Details coming soon. Panel Information ----------------- Details coming soon. Paper Submission and Registration --------------------------------- Abstracts and papers need to be submitted via the EasyChair conference management system. We request the authors to use the LNCS style (single column format) using either the LaTeX document class or Word template. For details on the author guidelines, please refer to Springer's website (http://www.springer.com/computer/lncs?SGWID=0-164-6-793341-0) Incorrectly formatted papers will be excluded from the reviewing process. Submission must be made as a single PDF file which includes all figures and bibliography. Submissions are accepted under the following two categories: * Full Paper: 12 pages with all figures and bibliography in the LNCS format described above * Short Paper: 8 pages with all figures and bibliography in the LNCS format described above Papers should present original research and should provide sufficient background material to make them accessible to the broader community. It should not be submitted in parallel to any other conference or journal. At least one of the authors of each accepted paper must register as a participant of the workshop and present the paper at the workshop. Each research paper will be taken through a comprehensive peer review process by an internationally recognized group of experts in the field. Papers will be evaluated along the metrics of: a) Quality of Presentation; b) Novelty / Originality; c) Relation to State of the Art; d) Technical Strength; e) Significance of Work; and f) Relevance to Workshop. Every effort will be made to ensure that each paper receives multiple reviews. Please contact the Workshop Organizers for any questions / clarifications. Proceedings Information ----------------------- The papers accepted to be presented in ExaComm'21 will be published in a separate, post-conference joint ISC workshop proceedings volume, published online with Springer Publishing. It serves the purpose to share your paper during the workshop day and to foster discussions. These PDFs will be deleted a week after the conference. You may adjust your paper for the camera-ready version after the workshop day and improve it based on the feedback received. The process for preparing the conference-ready and camera-ready versions of accepted papers is described below. There are two deadlines you have to consider: * Conference-ready deadline: Friday, May 21, 2021 * Camera-ready deadline: Early August, 2021 The conference-ready paper version will be hosted during the conference and the link will be shared with workshop attendees. It serves the purpose to share your paper during the workshop day and to foster discussions. These PDFs will be deleted a week after the conference. You may adjust your paper for the camera-ready version after the workshop day and improve it based on the feedback received. The camera-ready version will be prepared for publication with Springer. Papers need to be formatted according to Springer's single column LNCS style (LaTeX or Word). https://www.springer.com/us/computer-science/lncs/conference-proceedings-gu… More details coming soon. Important Dates --------------- Abstract submission deadline: 11:59 PM, AoE, Monday, March 22, 2021 Paper submission deadline: 11:59 PM, AoE, Monday, March 29, 2021 Monday, April 19, 2021 Paper review deadline: Thursday, April 29, 2021 Author notification: Monday, May 3, 2021 Conference-ready deadline: Friday, May 21, 2021 Workshop Day: Friday, July 2, 2021 Camera-ready deadline: Early August, 2021 ExaComm'21 Workshop Organizers ------------------------------ Hari Subramoni, The Ohio State University Dhabaleswar K. (DK) Panda, The Ohio State University Web and Publicity Chair ----------------------- Aamir Shafi, The Ohio State University Program Committee ----------------- Details coming soon. Further Information ------------------- See the ExaComm '21 website at: http://nowlab.cse.ohio-state.edu/exacomm/ Thanks, The ExaComm '21 Organizing Committee.

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ISCC 2021 - the 26th IEEE Symposium on Computers and Communications
by angalletta＠ieee.org 28 Mar '21

28 Mar '21

Dear users of Hpc-Announce mailing list, ============================= CALL FOR PAPERS =============================== The 26th IEEE Symposium on Computers and Communications (IEEE ISCC 2021) Submission Due Date: May 15, 2021 Conference Dates: September 5-8, 2021 Conference Venue: Athens, Greece Submission Website: https://iscc2021.edas.info/N28231 Conference Website: https://iscc2021.unipi.gr ============================================================================= Welcome to the 26th IEEE Symposium on Computers and Communications (ISCC). The first IEEE Symposium on Computers and Communications (ISCC) was held in 1995 in response to the growing interaction between the fields of computers and communications. ISCC takes place annually, usually in the Mediterranean region, in locations such as Egypt, Greece, France, Tunisia, Portugal, Spain, Morocco, Italy, and Brazil. In 2021, the Symposium is going to be held in Athens, Greece. ISCC sessions will include presentations on new research results and tutorials. Papers describing original work are invited in any of the computer and communications areas that the Call for Papers considers. Accepted papers will be included in the ISCC 2021 Conference Proceedings, which will be subject to independent peer-review procedures for quality, and may be eligible for inclusion in the IEEE Xplore® Digital Library. Merit, relevance, and originality will guide paper acceptance. Best Paper Award and Best Student Paper Awards will be presented. ISCC 2021, in its 26th edition, will provide an insight into the unique world stemming from the interaction between the fields of computers and communications. ISCC 2021 will provide an international technical forum for experts from industry and academia to exchange ideas and present results of on-going research in most state-of-the-art areas of computers and communications. You are invited to submit a full paper, a proposal for a Panel/Invited Session or a Tutorial, related to the following topics of interest: * 5th Generation Networks (5G) * Resource Allocation * Network Slicing * Topology Management * 5G Core Network and Service Based Architecture * C-RAN and backhaul * SDN and NFV for 5G * Network Stability, Control and Optimization * Standardization Activities by IEEE, 3GPP and ETSI * Artificial Intelligence (AI) * Artificial Intelligent Systems applications in Computers and Communications * Game Theory * Machine Learning * Bio-inspired Computing in Communications * Data Science and Data Engineering * Distributed Knowledge and Processing * Trusted AI * Cloud and Edge Computing * Cloud Computing (IaaS, PaaS, and SaaS) * Mobile Cloud and Mobile Cloud Networking * Fog Computing * Distributed Systems Architecture and Management * Internet of Things (IoT) * LPWAN (LoRa, Sigfox, NB-IoT, LTE-M, Wi-SUN) * 6TiSCH, 6LoWPAN, Roll * Rest API, CoAP, CBOR, OSCORE * Smart Spaces * Cyber Physical Systems * Telecare Medical Information System * Optical Networks * Optical Network Protocols and Architectures * Energy-efficient/green Optical Communications and Networks * Visible Light Communications (Indoor, Outdoor and Localization) * Optical Wireless Communication Applications for Future Networks * Vehicular Networks * Intelligent Transport Systems (ITS) * IEEE 802.11p ITS-G5 * Millimeter Waves * V2X, V2I, V2N, V2V, V2P, V2D, V2G * Inter and intra vehicle communication and protocols * Wireless Networks * Cognitive Radio Networking * Wireless, Cellular, and Mobile Communications * Modeling and Simulation * Signal Processing for Communications * Services and Protocols * Advances in Internet Protocols * Green Networking * Real Time Communication Services * Routing and Multicast * Network Design, Optimization and Management * Network Reliability, Quality of Service and Quality of Experience * Fault-Tolerance and Error Recovery * Web Services and Service Oriented Architectures * Standards Evolution * Digital Satellite Communications Service * Localization Protocols * Communications Services and Management * Crowdsourcing applications * Peer-to-Peer Computing * Software Defined * Software Defined Networks and Network Function Virtualization * Software Defined Smart Objects * Software Defined Data Centers * Software Defined Radio * Overlay and Programmable Networks * Security and Privacy * Data Privacy * Attacks and Defenses * Authentication, Authorization and Accounting * Hardware Security * Intrusion Detection * Moving Target Defense (MTD) * Blockchain * Application domain / Framework / Architecture * e-Health and Bioinformatics * Smart Grid * Smart City * Industry 4.0 * Smart Building =========================== Submission Guidelines =========================== Papers must be submitted electronically as a PDF file through the conference management system, at: https://iscc2021.edas.info/N28231 Please note: (1) All papers will be reviewed by the Program Committee on the basis of technical quality, relevance, originality, significance, and clarity. All paper submissions will be handled electronically. Papers that do not comply with the Submission Guidelines will be rejected without review. (2) All papers should be submitted electronically in PDF and be no longer than 7 pages in the IEEE double column proceedings format including tables, figures and references. Papers exceeding 7 pages will not be accepted. Download manuscript templates for IEEE conference proceedings: https://www.ieee.org/conferences/publishing/templates.html (3) Best Paper Award and Best Student Paper Awards will be presented. (4) Accepted papers up to 6 pages will be published with no additional charge. Exceeding page(s) will be charged an additional fee. (5) At least one author of each accepted paper is required to register to the conference and present the paper. Only registered and presented papers will be published in the conference proceedings. Accepted papers will be included in the ISCC 2021 Proceedings and will be submitted for inclusion to IEEE Xplore. The ISCC Proceedings have been indexed in the past by ISI, dblp and Scopus. This makes the ISCC conference one of the publication venues with very high visibility and impact in both Computer and Communications areas. =========================== Important Dates =========================== * Paper submission deadline: May 15, 2021 * Notification of paper acceptance: July 15, 2021 * Submission of camera-ready papers: TBA * Conference Dates: September 5-8, 2021 =========================== Organizing Committee =========================== * General Co-Chairs: * Christos Douligeris, University of Piraeus, Greece * Luca Foschini, University of Bologna, Italy * TPC Co-Chairs: * Gang Li, Deakin University, Australia * Eirini Eleni Tsiropoulou, University of New Mexico, USA * Theofanis Raptis, National Research Council (CNR), Italy * Workshops and Tutorial Co-Chairs: * Nathalie Mitton, Inria Lille-Nord Europe, France * Michael Kounavis, Intel, USA * Fabrice Theoleyre, CNRS, Paris, France * Keynote Co-Chairs: * Konstandinos Samdanis, Nokia Bell Labs, Germany * Massimo Villari, University of Messina, Italy * Periklis Chatzimisios, International Hellenic University, Greece * Poster and Demo Chair: * Dinitris Zorbas, Nazarbayev University, Kazakstan * Publicity Co-Chairs: * Min Yu, Institute of Information Engineering, Chinese Academy of Sciences, China * Luis Henrique Maciel Kosmalski Costa, EFRJ, Brasil * Rodrigue Domga Komguem, University of Yaoundé in Cameroon, Capital of Cameroon * Ye Zhu, Deakin University, Australia * Antonino Galletta, University of Messina, Italy * Publication Co-Chairs: * Dimitrios Kallergis, University of West Attica, Greece * Adel Elmaghraby, University of Louisville, USA * Finance and Registration Co-Chairs: * Theodoros Karvounidis, University of Piraeus, Greece * Reda Ammar, University of Connecticut, USA * Local Co-Chairs: * Rosa Mavropodi, University of Piraeus, Greece * Zacharenia Garofalaki, University of Piraeus and University of West Attica, Greece * Webmaster: * Rosa Mavropodi, University of Piraeus, Greece =========================== Steering Committee =========================== * Reda Ammar, University of Connecticut, USA * Antonio Corradi, University of Bologna, Italy * Mario Dantas, Universidade Federal de Juiz de Fora, Brazil * Christos Douligeris, University of Piraeus, Greece * Adel S. Elmaghraby, University of Louisville, USA * Hussein Mouftah, University of Ottawa, USA * Sartaj Sahni, University of Florida, USA * Susana Sargento, Instituto de Telecomunicacoes, University of Aveiro, Portugal * Massimo Villari, University of Messina, Italy

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FCCM 2021 - Call for Demos
by Gabriel Weisz 26 Mar '21

26 Mar '21

FCCM 2021 - Call for Demos The IEEE International Symposium on Field-Programmable Custom Computing Machines (FCCM) is the original and premier forum for presenting and discussing new research related to computing that exploits the unique features and capabilities of FPGAs and other reconfigurable hardware. The FCCM 2021 Demo Night is a show-and-tell event on Monday, May 10, 2021. As this year's FCCM conference is virtual, demos will be live-streamed and include a live Q&A with demo presenters. All conference attendees are invited to the demo night to mingle and share knowledge in an informal setting. Demonstrations may include system designs, platforms, tools, and more. The Demo Night is a great opportunity for representatives of the most prominent industries in the field to meet with the leading FCCM researchers, which might include prospective customers or potential future employees. This event is also an excellent occasion for academic researchers to increase their visibility, demonstrate their latest work, show how to use open source software or building blocks, and receive early feedback on their work in progress. Prospective demo presenters should submit author information, title, and abstract to gabriel.weisz(a)microsoft.com by Monday, April 26, 2021.

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[CFP] 9th Workshop on Data Flow inspired Models for Extreme-Scale Computing
by Stephane Zuckerman 26 Mar '21

26 Mar '21

9th IEEE International Workshop on Data Flow Models and Extreme-Scale Computing (DFM 2021) Hosted as part of COMPSAC 2021, July 12—16, 2021, All-Virtual This workshop is organized as part of the activities of the IEEE Computer Society Dataflow STC. The ninth installment of the international workshop on Data Flow Models (DFM) for extreme-scale computing is held this year in conjunction with the COMPSAC conference. The purpose of DFM continues to being to bring together those researchers interested in novel computational models based on dataflow principles of execution. The switch to multi-core systems, at both the high-performance and embedded levels, has raised concurrency to the level of a major issue, with the trend of increasing the core count on a chip continuing, as well as energy and resiliency issues coming to the fore of major issues to tackle. Computer systems, both for high-performance and embedded computing, have now fully embraced parallelism at the hardware and software levels. From the HPC systems viewpoint, new challenges have arisen, which are common issues in the embedded world: power and energy efficiency are now major issues to be overcome when considering building efficient supercomputers. Conversely, harnessing true parallel systems is now necessary to efficiently exploit embedded systems equipped with multiple cores. Moreover, fault-tolerance and resiliency must also be taken into consideration, at both the hardware and software level. Finally, many such systems (both embedded and HPC) are networked together, forming extremely large distributed and parallel systems. Dataflow-inspired models of computation, once discarded by the sequential programming crowd, are again considered serious contenders to help increase programmability, performance, and scalability in highly parallel and extreme scale systems. By their very nature, dataflow and event-driven inspired models tend to naturally solve (if only partially) some of the newer problems related to power and energy efficiency, or provide fertile ground to help with implementing efficient fault-tolerance and resiliency mechanisms, as many of the required properties are enmeshed in the models themselves. Yet, to achieve high scalability and performance, modern computing systems, both HPC and embedded, rely on heterogeneous means to carry out computations: GPUs, FPGAs, etc. Meanwhile, legacy programming and execution models, such as MPI and OpenMP, add asynchronous and data-driven constructs to their models, all the while trying to take into account the very complex hardware targeted by parallel applications. Consequently, programming and execution models, trying to combine both legacy control flow-based and data flow-based aspects of computing, have also become increasingly complex to handle. Developing new models and their implementation, from the application programmer level, to the system level, down to the hardware level is key to provide better data- and event-driven systems which can efficiently exploit the wealth of diversity that composes current high-performance systems, for extreme scale parallel computing. To this end, the whole stack, from the application programming interface down to the hardware must be investigated for programmability, performance, scalability, energy and power efficiency, as well as resiliency and fault-tolerance. All these aspects may have a different impact on high-performance computing and embedded systems. Researchers and practitioners all over the world, from both academia and industry, working in the areas of language, system software, and hardware design, parallel computing, execution models, and resiliency modeling are invited to discuss state of the art solutions, novel issues, recent developments, applications, methodologies, techniques, experience reports, and tools for the development and use of data flow models of computation. Topics of interest include, but are not limited to, the following: DFM 2021 solicits novel papers that include but are not limited to: • Programming languages and compilers for existing and new languages — in particular single-assigned and functional languages • System software: Operating systems, runtime systems • Hardware design: ASICs and reconfigurable computing (FPGAs) • Resiliency and fault-tolerance for parallel and distributed systems • New data flow inspired execution models — in particular strict and non-strict models • Hybrid system design for control-flow and data-flow based systems • Applications and modeling for IoT and Edge Computing systems • Position papers on the future of data flow in the era of parallel and distributed many-core systems, and beyond, including heterogeneous systems SUBMISSION INFORMATION DFM 2021 will accept both full (6 pages) and short papers (4 pages). Full page papers may go up to 8 pages for a fee. Papers should be prepared using the IEEE Proceedings format; Short Papers could be submitted in the form of extended abstracts. All accepted papers will appear in the Computer Society Digital Library. Submission site https://easychair.org/my/conference.cgi?welcome=1;conf=compsac2021. IMPORTANT DATES Workshop papers due: 21 April 2021 Workshop paper notifications: 15 May 2021 Camera-ready and registration due: 31 May 2021 PROGRAM COMMITTEE Stéphane Zuckerman CY Cergy Paris Université Erik Altman IBM Albert Cohen Google John Feo Pacific Northwest National Laboratory Guang R. Gao University of Delaware Jean-Luc Gaudiot University of California, Irvine Roberto Giorgi University of Sienna Sven-Bodo Scholz Heriot-Watt University Arthur Stoutchinin ST Microelectronics -- Maître de conférences / Associate Professor Chargé de mission accompagnement jeunes chercheurs — laboratoire ETIS Directeur des études de première année — IUT GEII (Neuville) Laboratoire ETIS, UMR 8051, CY Cergy Paris Universités, ENSEA, CNRS F-95000, Cergy, France

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